PIC Awards - rewarding excellence, innovation and success
https://picawards.netIntengent is shortlisted for the prestigious PIC Award in the category Best Achievement in PIC Platform for development and commercialization of its flagship PIC technology – Taper-Assisted Vertical Integration (TAVI)
Compound Semiconductors International Conference (CS International 2019)
March 26th 2019, Brussels, Belgium www.cs-international.netIntengent's President and CEO Dr. Valery Tolstikhin will be giving an invited presentation entitled: "Fabless PICs in InP: Why, What, and How?"
6th Workshop on Photonic Integrated Circuits at Optical Fiber Communications Conference (OFC 2019)
March 6th 2019, San-Diego, CA, USA www.ofcconference.orgIntengent's President and CEO Dr. Valery Tolstikhin will be participating in the overview of photonic integration landscape with a presentation: “Regrowth-Free Taper-Assistant Vertical Integration (TAVI) Platform for Fabless PICs in InP”
Photonic Integration Week (PIW 2019)
January 14th 2019, Valencia, Spain piw.webs.upv.esIntengent's President and CEO Dr. Valery Tolstikhin will be giving a talk: “Fabless PICs in InP Based on Taper-Assisted Vertical Integration Platform”
compoundsemiconductor.net/article/104117
Intengent has been profiled in the Compound Semiconductor magazine, in the article “Photonics ICs Prepped For Market” ()
www.semiconductor-today.com/news_items/2018/jan/gcs-intengent_260118.shtml
Intengent, Global Communication Semiconductors (GCS), and VLC Photonics partner on one-stop fabless development services for InP PICs